Electroluminescence display device and fabrication method thereof

ABSTRACT

Embodiments of the disclosure disclose an electroluminescence display device and a fabrication method thereof. The device comprises a color filter substrate. The color filter substrate comprises: a first substrate, and a first electrode, an organic electroluminescence layer and a second electrode sequentially provided on the first substrate. The color filter substrate further comprises: a first protective layer, provided on the second electrode and covering the second electrode and the organic electroluminescence layer below the second electrode; and a first connection electrode, provided on the first protective layer and connected to the second electrode.

TECHNICAL FIELD

Embodiments of the disclosure relate to an electroluminescence displaydevice and a fabrication method thereof.

BACKGROUND

Recently, Organic Light Emitting Diode (OLED) display device, alsoreferred to as electroluminescence display device, has been widelyapplied to a mobile communication terminal, a personal digital assistant(PDA), a pocket PC, etc., due to its outstanding features such asself-luminescence, no need of backlight, high contrast, small thickness,wide viewing angle, quick response, suitable for wide temperature range,simple structure, simple fabrication process, and so on. The OLEDdisplay devices are divided into a passive matrix type and an activematrix type. In the OLED display device of active matrix type, each OLEDis controlled by a Thin Film Transistor (TFT) circuit, and highluminescence efficiency and good image display effect can be achieved.

A conventional OLED display device of active matrix type is shown inFIG. 1, and comprises a color filter substrate 10 and an array substrate20. A fabrication process of the color filter substrate comprises:sequentially forming a color filter layer, a flattening layer 13, afirst electrode 14, an organic electroluminescence (EL) layer 15 and asecond electrode 16 on a first substrate 11. The color filter layercomprises a black matrix 121 and color filters 122 separated by theblack matrix 121. A fabrication process of the array substratecomprises: forming a thin film transistor 22 on a second substrate 21,covering a protective layer 23 on the thin film transistor 22, and thenforming a connection electrode 24 on the protective layer 23. Theconnection electrode 24 is electrically connected with a drain electrodethe thin film transistor 22 through a via hole provided in theprotective layer 23. Finally, a sealant 30 is coated on an edge of thecolor filter substrate 10 and/or array substrate 20, the color filtersubstrate 10 and the array substrate 20 are bonded with each other, andthe second electrode 16 on the color filter substrate is in contact withthe corresponding connection electrode 24 on the array substrate 20 soas to be electrically connected with each other.

In the above OLED display device shown in FIG. 1, the organicelectroluminescence layer 15 is provided in a space enclosed by thecolor filter substrate 10, the array substrate 20 and the sealant 30;because the sealing effect of the sealant 30 is not enough, it is veryeasy for oxygen and moisture in the air to damage the organicelectroluminescence layer 15, thus the service life and reliability ofthe OLED display device are degraded.

SUMMARY

According to embodiments of the disclosure, an electroluminescencedisplay device is provided. The device comprises a color filtersubstrate. The color filter substrate comprises: a first substrate, anda first electrode, an organic electroluminescence layer and a secondelectrode sequentially provided on the first substrate. The color filtersubstrate further comprises: a first protective layer, provided on thesecond electrode and covering the second electrode and the organicelectroluminescence layer below the second electrode; and a firstconnection electrode, provided on the first protective layer andconnected to the second electrode.

For example, at a position where the first connection electrode isprovided, the first protective layer protrudes along a direction awayfrom the second electrode to form a protrusion; the first protectivelayer is provided with a first protective layer via-hole at theprotrusion; and the first connection electrode is connected to thesecond electrode through the first protective layer via-hole.

For example, the color filter substrate further comprises: a colorfilter layer provided between the first substrate and the firstelectrode; the color filter layer comprises a black matrix and colorfilters separated by the black matrix; the second electrode is providedto correspond to the color filter, and the first connection electrode isprovided to correspond to the black matrix; in a region corresponding tothe first connection electrode, the first protective layer protrudesalong a direction away from the second electrode to from a protrusion;the first protective layer is provided with a window at a position wherethe second electrode is provided, and a portion of or the entire of thesecond electrode is exposed out of the window; the first connectionelectrode is provided on the protrusion, and the first connectionelectrode extends to the window to partially or completely covering anexposed portion of the second electrode.

For example, the protrusion has a height of 1.5-2.5 micron.

For example, the first connection electrode has a thickness of 0.3-1micron.

For example, the first protective layer is made of silicon nitride,silicon oxide, photosensitive resin, or combinations thereof.

For example, the photosensitive resin is a polyacrylic resin, apolyimide resin, or a polyamide resin.

For example, the device further comprises an array substrate. The arraysubstrate comprises: a second substrate, a thin film transistor providedon the second substrate, a protective layer covering the thin filmtransistor, and a second connection electrode provided on the protectivelayer; and the protective layer is provided with a protective layervia-hole, and the second connection electrode is connected to a drainelectrode of the thin film transistor through the protective layervia-hole.

For example, the second connection electrode is in contact with and iselectrically connected with the first connection electrode.

For example, at a position where the second connection electrode isprovided, the protective layer protrudes along a direction away from thethin film transistor to form a protrusion.

According to embodiments of the disclosure, a fabrication method of anelectroluminescence display device is provided. The method comprises afabrication process of a color filter substrate. The fabrication processof the color filter substrate comprises: forming a first electrode, anorganic electroluminescence layer and a second electrode on a firstsubstrate; forming a first protective layer on the first substrate onwhich the first electrode, the organic electroluminescence layer and thesecond electrode have been formed, the first protective layer coveringthe second electrode and the organic electroluminescence layer below thesecond electrode; and forming a first connection electrode on the firstsubstrate on which the first electrode, the organic electroluminescencelayer, the second electrode and the first protective layer have beenformed, the first connection electrode being connected with the secondelectrode.

For example, the forming the first protective layer comprises: formingthe first protective layer; and forming a protrusion at a position ofthe first protective layer where the first connection electrode is to beformed and meanwhile forming a first protective layer via-hole at theprotrusion by a patterning process.

For example, before the forming the first electrode, the organicelectroluminescence layer and the second electrode on the firstsubstrate, the method further comprises: forming a color filter layer,the color filter layer comprises a black matrix and color filtersseparated by the black matrix; the forming the first protective layercomprises: forming the first protective layer; and forming a protrusionat a position of the first protective layer where the first connectionelectrode is to be formed by a patterning process, and meanwhile forminga window at a position where the second electrode is located so that aportion of or the entire of the second electrode is exposed out of thewindow, the second electrode being provided to correspond to the colorfilter, and the first connection electrode being provided to correspondto the back matrix; the forming the first connection electrodecomprises: forming an electrode layer, and forming the first connectionelectrode on the protrusion and on an exposed portion of the secondelectrode by a patterning process, the first connection electrodepartially or completely covering the exposed portion of the secondelectrode.

For example, the fabrication method further comprises a fabricationprocess of an array substrate. The fabrication process of the arraysubstrate comprises: forming a thin film transistor on a secondsubstrate; forming a protective layer on the thin film transistor, andforming a protective layer via-hole above a drain electrode of the thinfilm transistor by a patterning process; forming a second connectionelectrode on the protective layer, the second connection electrode beingconnected with the drain electrode of the thin film transistor throughthe protective layer via-hole.

For example, the fabrication process of the array substrate furthercomprises: at a position where the second connection electrode isprovided, the protective layer protrudes along a direction away from thethin film transistor to form a protrusion.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to clearly illustrate the technical solution of the embodimentsof the disclosure, the drawings of the embodiments will be brieflydescribed in the following; it is obvious that the described drawingsare only related to some embodiments of the disclosure and thus are notlimitative of the disclosure.

FIG. 1 is a structural schematic view illustrating a conventional OLEDdisplay device of active matrix type;

FIG. 2 is a structural schematic diagram I illustrating anelectroluminescence display device according to embodiments of thedisclosure;

FIG. 3 is a structural schematic diagram II illustrating theelectroluminescence display device according to the embodiments of thedisclosure;

FIG. 4 is a structural schematic diagram III illustrating theelectroluminescence display device according to the embodiments of thedisclosure;

FIG. 5 is a structural schematic diagram IV illustrating theelectroluminescence display device according to the embodiments of thedisclosure;

FIG. 6( a) is a structural schematic view illustrating a color filtersubstrate before a protective layer is formed according to theembodiments of the disclosure;

FIG. 6( b) is a structural schematic diagram I illustrating the colorfilter substrate after the protective layer is formed according to theembodiments of the disclosure; and

FIG. 6( c) is a structural schematic diagram II illustrating the colorfilter substrate after the protective layer is formed according to theembodiments of the disclosure.

DESCRIPTION OF THE EMBODIMENTS

In order to make objects, technical details and advantages of theembodiments of the disclosure apparent, the technical solutions of theembodiment will be described in a clearly and fully understandable wayin connection with the drawings related to the embodiments of thedisclosure. It is obvious that the described embodiments are just a partbut not all of the embodiments of the disclosure. Based on the describedembodiments herein, those skilled in the art can obtain otherembodiment(s), without any inventive work, which should be within thescope of the disclosure.

In the specification and claims of the disclosure, words such as“first”, “second” or the like do not denote any sequence, quantity orsignificance, but are only used for distinguishing different components.

Embodiments of the disclosure provide an electroluminescence displaydevice. As shown in FIG. 2, the device comprises: a color filtersubstrate 10 and an array substrate 20. The color filter substrate 10comprises: a first substrate 11, and a color filter layer, a flatteninglayer 13, a first electrode 14, an organic electroluminescence layer 15and a second electrode 16 sequentially provided on the first substrate11. The color filter substrate 10 further comprises: a first protectivelayer 17, provided on the second electrode 16 and covering the secondelectrode 16 and the organic electroluminescence layer 15 below thesecond electrode 16; and a first connection electrode 18, provided onthe first protective layer 17. The first connection electrode 18 isconnected with the second electrode 16.

In the embodiments of the disclosure, the first protective layer 17entirely covers the color film substrate where the first electrode 14,the organic electroluminescence layer 15 and the second electrode havebeen formed, that is, the first protective layer 17 entirely covers thesecond electrode 16 and the organic electroluminescence layer 15 belowthe second electrode 16, in order to ensure that the organicelectroluminescence layer 15 has no portions exposed outside. The firstconnection electrode 18 is provided on the first protective layer 17,and the first connection electrode 18 is connected with the secondelectrode 16 through a first protective layer via-hole 172 in the firstprotective layer 17.

In the embodiments of the disclosure, the first protective layer 17entirely covers the second electrode 16 and the organicelectroluminescence layer 15 below the second electrode 16, whichprevents the organic electroluminescence layer 15 from being damaged bywater and oxygen. Thus, the reliability of the OLED display device isimproved, and the service life of the OLED display device is prolonged.

As shown in FIG. 3, at a position where the first connection electrode18 is provided, the first protective layer 17 protrudes along adirection away from the second electrode 16 to form a protrusion 171;the first protective layer via-hole 172 is located at the protrusion171, and the first connection electrode 18 is connected to the secondelectrode 16 through the first protective layer via-hole 172.

The first protective layer 17 is formed to have protrusions, eachprotrusion 171 is provided with the first protective layer via-hole 172,the first connection electrode 18 is provided on each protrusion 171,and the first connection electrode 18 is connected with the secondelectrode 16 through the first protective layer via-hole 172. Positionsof the protrusion 171 and the first connection electrode 18 correspondto a thin film transistor serving as a driving element on the arraysubstrate.

In addition, as shown in FIG. 2 and FIG. 3, the electroluminescencedisplay device in the embodiments of the disclosure further comprises anarray substrate 20; the array substrate 20 comprises: a second substrate21, the thin film transistor 22, a protective layer 23 covering the thinfilm transistor 22 and a second connection electrode 25 provided on theprotective layer 23, and the thin film transistor 22, the protectivelayer 23 and the second connection electrode 25 are sequentiallyprovided on the second substrate 21. The protective layer 23 is providedwith a protective layer via-hole 231, through which the secondconnection electrode 25 is connected to a drain electrode of the thinfilm transistor 22. A sealant 30 is coated on an edge of the colorfilter substrate 10 and/or array substrate 20, the color filtersubstrate 10 and the array substrate 20 are bonded with each other toform the electroluminescence display device. After the color filtersubstrate 10 and the array substrate 20 are bonded with each other, thesecond connection electrode 25 is in contact with and is electricallyconnected with the first connection electrode 18, such that the thinfilm transistor 22 is connected with the second electrode 16.

It should be noted that a TFT circuit (a driving circuit) is provided onthe array substrate 20 so as to drive and compensate the OLED. In theembodiments of the present disclosure, by the connection of the firstand second connection electrodes after the color filter substrate 10 andthe array substrate 20 are bonded with each other, the electricalconnection between the driving circuit and the light emitting device isaccomplished. The TFT circuit at least comprises the thin filmtransistor 22 serving as the driving element. It should be noted that, aspecific structure of the TFT circuit has no direct relationship withthe embodiments of the present disclosure, nor does it affect effects ofthe embodiments of the disclosure; therefore, the embodiments of thedisclosure do not limit the structures of the TFT circuit, which may beany one well known by those skilled in the art.

The protrusion shown in FIG. 3 raises the first connection electrode 18,and the array substrate and the color filter substrate bonded with eachother have a bearing point at a contact surface between the firstconnection electrode 18 and the second connection electrode 25 so thatthe reliability of the electrical connection between the firstconnection electrode 18 and the second connection electrode 25 isimproved. On the other hand, the first connection electrode 18 is raisedby the protrusion, and meanwhile the first protective layer 17 coversthe organic electroluminescence layer 15, so as to avoid damage to theorganic electroluminescence layer 15 caused by squeezing or frictionbetween the color filter substrate and the array substrate during thebonding process and after the bonding process.

As shown in FIG. 4, the color filter layer comprises a black matrix 121and color filters 122 separated by the black matrix 121. The secondelectrode 16 is provided to correspond to the color filter 122, and thefirst connection electrode 18 is provided to correspond to the backmatrix 121. In a region corresponding to the first connection electrode18, the first protective layer 17 protrudes along a direction away fromthe second electrode 16 to from the protrusion 171. The first protectivelayer 17 is provided with a window 173 at a position where the secondelectrode 16 is located, and a portion of or the entire of the secondelectrode 16 is exposed out of the window 173. The first connectionelectrode 18 is provided on the protrusion 171, and the first connectionelectrode 18 extends to the window 173 to partially or completely coveran exposed portion of the second electrode 16.

For example, in the embodiments of the present disclosure, the colorfilters 122 comprise, but not limited to, a red color filter, a greencolor filter and a blue color filter (R/G/B). In the embodiments of thepresent disclosure, the window 173 is provided to correspond to thecolor filter 122 in the color filter layer, and the protrusion 171 isprovided to correspond to the black matrix 121; and the secondconnection electrode 25 is in contact with and is electrically connectedwith the first connection electrode 18 on the protrusion 171 at the timeof bonding the color filter substrate with the array substrate. Afterthe color filter substrate and the array substrate are bonded with eachother, the bearing point is on the protrusion 171, so the protrusion inthe embodiments of the disclosure reduces the force exerted on theorganic electroluminescence layer 15 in a region (a pixel region)corresponding to the color filter 122 to better protect the organicelectroluminescence layer 15.

As shown in FIG. 5, in a region corresponding to the second connectionelectrode 25 on the array substrate 20, the protective layer 23protrudes along a direction away from the thin film transistor 22 toform a second protrusion 232; and the protective layer via-hole 231 isprovided at the second protrusion 232. The second connection electrode25 is raised by the second protrusion 232, which can avoid damage to thethin film transistor caused by squeezing or friction between the colorfilter substrate 10 and the array substrate 20 during or after bondingthe color filter substrate and the array substrate. Thus, the yield isimproved.

For example, the first protective layer 17 is made of silicon nitride,silicon oxide, photosensitive resin, or combinations thereof. Forexample, the photosensitive resin is: a polyacrylic resin, a polyimideresin, or a polyamide resin. For example, a silicon nitride film isfirstly formed, and then a silicon oxide film is formed on the siliconnitride film, so that the silicon nitride film and the silicon oxidefilm constitute the first protective layer 17.

For example, the protrusion 171 has a height of 1.5-2.5 micron. Forexample, the first connection electrode 18 has a thickness of 0.3-1micron. Due to the existences of the protrusions, the first connectionelectrode 18 and the second connection electrode 25 is fabricated to bethinner, so that a deposition time and an etching time of the firstconnection electrode 18 and the second connection electrode 25 areshortened, thereby simplifying the fabrication process and improving theproduction efficiency.

In the electroluminescence display device in the embodiments of thedisclosure, on the one hand, the organic electroluminescence layer isprevented from being damaged by water and oxygen, thus reliability ofthe OLED display device is improved and the service life of the OLEDdisplay device is prolonged; and on the other hand, defects caused bysqueezing or friction between the color filter substrate and the arraysubstrate is avoided, so that the yield is improved.

The embodiments of the disclosure further provide a fabrication methodof an electroluminescence display device, and the method comprises: afabrication process of a color filter substrate, a fabrication processof an array substrate, and a process of bonding the color filtersubstrate and the array substrate. For example, the fabrication processof the color filter substrate comprises the following steps.

101: forming a first electrode 14, an organic electroluminescence layer15 and a second electrode 16 on a first substrate 11.

As shown in FIG. 6( a), a color filter layer, a flattening layer 13, thefirst electrode 14, the organic electroluminescence layer 15 and thesecond electrode 16 are sequentially formed on a base substrate (i.e.,the first substrate 11) of the color filter substrate. The color filterlayer, the flattening layer 13, the first electrode 14, the organicelectroluminescence layer 15 and the second electrode 16 may be made ofany known materials with any known methods, which will not be repeatedhere.

102: forming a first protective layer 17 on the first substrate on whichthe first electrode 14, the organic electroluminescence layer 15 and thesecond electrode 16 have been formed, the first protective layer 17covering the second electrode 16 and the organic electroluminescencelayer 15 below the second electrode 16, as shown in FIG. 6( b).

For example, the first protective layer 17 is made of silicon nitride,silicon oxide, photosensitive resin, or combinations thereof. Forexample, the first protective layer 17 is made of the photosensitiveresin; and in this case, the deposition process is simple, and onlyexposure and development are required to form a first protective layervia-hole 172 without etching.

103: forming a first connection electrode 18 on the first substrate onwhich the first electrode 14, the organic electroluminescence layer 15,the second electrode 16 and the first protective layer 17 have beenformed, the first connection electrode 18 being connected with thesecond electrode 16 (for example, through the first protective layervia-hole 172), as shown in FIG. 2 and FIG. 3.

In the fabrication method of the electroluminescence display deviceaccording to the embodiments of the disclosure, the first protectivelayer 17 entirely covers the second electrode 16 and the organicelectroluminescence layer 15 below the second electrode 16, so that theorganic electroluminescence layer 15 has no portion exposed outside.Thus, the organic electroluminescence layer 15 is prevented from beingdamaged by water and oxygen, the reliability of the OLED display deviceis improved and the service life of the OLED display device isprolonged.

For example, the first protective layer 17 is provided to haveprotrusions, as shown in FIG. 6( c). In this case, the step 102 offorming the first protective layer 17 comprises:

Step 1: forming the first protective layer 17;

Step 2: forming a protrusion 171 at a position of the first protectivelayer 17 where the first connection electrode 18 is to be formed andmeanwhile forming the first protective layer via-hole 172 at theprotrusion 171 by a patterning process.

With reference to FIG. 4, before the forming the first electrode, theorganic electroluminescence layer and the second electrode on the firstsubstrate, the step 101 further comprises: forming the color filterlayer, and the color filter layer comprises: a black matrix 121 andcolor filters 122 separated by the black matrix 121. In such case, thestep 102 comprises: forming the first protective layer 17, and formingthe protrusion 171 at the position of the first protective layer 17where the first connection electrode 18 is to be formed by thepatterning process, and meanwhile forming a window 173 at a position ofthe first protective layer 17 where the second electrode 16 is locatedso that a portion of or the entire of the second electrode 16 is exposedout of the window 173. The second electrode 16 is provided at a positioncorresponding to the color filter 122, and the first connectionelectrode 18 is provided at a position corresponding to the back matrix121. The Step 103 comprises: forming an electrode layer, and forming thefirst connection electrode 18 on the protrusion 171 and on an exposedportion of the second electrode 16 by a patterning process. The firstconnection electrode 18 partially or completely covering the exposedportion of the second electrode 16.

By taking the case that the first protective layer is made ofphotoresist (one type of photosensitive resin) as an example, thefabrication method of the electroluminescence display device comprisesthe steps of:

Step 1: forming the first electrode 14, the organic electroluminescencelayer 15, and the second electrode 16 on the color filter substrate, andcoating the photosensitive resin (for example, the photoresist) on thesecond electrode 16, forming the protrusion 171 at the position wherethe first connection electrode is to be formed by exposing anddeveloping processes, and meanwhile forming the window 173 at theposition where the second electrode 16 is provided;

Step 2: forming the electrode layer, and then forming the firstconnection electrode 18 on the protrusion 171 and on the exposed portionof the second electrode 16 by using the patterning process comprisingcoating photoresist, exposing, developing, etching, and removingphotoresist. The first connection electrode 18 partially or completelycovers the protrusion 171 and the portion of the second electrode 16exposed out of the window 173, so that the first connection electrode 18is electrically connected with the second electrode 16. For example, theelectrode layer is a metal layer, including, but not limited to, copper,molybdenum, tin, aluminum, silver, etc.

In the embodiments of the disclosure, the first protective layer 17 isprovided to have the protrusion, so that defects caused by squeezing orfriction between the color filter substrate and the array substrate isavoided and thus the yield is improved.

With reference to FIG. 2, the fabrication process of the array substratein the embodiments of the disclosure comprises: Step 1: forming a thinfilm transistor 22; Step 2: forming a protective layer 23 on the thinfilm transistor 22, and forming a protective layer via-hole 231 above adrain electrode of the thin film transistor 22 by a patterning process;Step 3: forming a second connection electrode 25 on the protectivelayer, the second connection electrode 25 being connected to the drainelectrode of the thin film transistor 22 through the protective layervia-hole 231.

Further, in the embodiments of the disclosure, the protective layer 23for example is provided to have protrusion, so that the secondconnection electrode 25 is raised by a second protrusion 232. Thus,damages to the thin film transistor caused by squeezing or frictionbetween the color filter substrate 10 and the array substrate 20 duringor after the bonding process are avoided, and the yield is improved.With reference to FIG. 5, the forming the protective layer 23 on thethin film transistor 22 for example comprises: forming the protectivelayer 23; forming the second protrusion 232 at a position of theprotective layer 23 where the second connection electrode 25 is to beformed by a patterning process, and meanwhile forming the protectivelayer via-hole 231.

After the fabrication process of the color filter substrate and thefabrication process of the array substrate are completed, the colorfilter substrate having the protrusion and the array substrate arebonded with each other, so that the second connection electrode 25 onthe array substrate is in contact with the first connection electrode 18located on the protrusion 171 of the color filter substrate to implementthe electrical connection between the drive circuit and the lightemitting device.

In the fabrication method of the electroluminescence display deviceaccording to the embodiments of the disclosure, on the one hand, theorganic electroluminescence layer is prevented from being damaged bywater and oxygen, thus the reliability of the OLED display device isimproved and the service life of the OLED display device is prolonged;and on the other hand, defects caused by squeezing or friction betweenthe color filter substrate and the array substrate is avoided, so thatthe yield is improved.

The foregoing embodiments merely are exemplary embodiments of thedisclosure, and not intended to define the scope of the disclosure, andthe scope of the disclosure is determined by the claims.

The present application claims priority of Chinese Patent ApplicationNo. 201310436149.X filed on Sep. 23, 2013, the disclosure of which isincorporated herein by reference in its entirety as part of the presentapplication.

1. An electroluminescence display device, comprising: a color filtersubstrate; the color filter substrate comprising: a first substrate, anda first electrode, an organic electroluminescence layer and a secondelectrode sequentially provided on the first substrate; wherein thecolor filter substrate further comprises: a first protective layer,provided on the second electrode and covering the second electrode andthe organic electroluminescence layer below the second electrode; and afirst connection electrode, provided on the first protective layer andconnected to the second electrode.
 2. The device according to claim 1,wherein at a position where the first connection electrode is provided,the first protective layer protrudes along a direction away from thesecond electrode to form a protrusion; the first protective layer isprovided with a first protective layer via-hole at the protrusion; andthe first connection electrode is connected to the second electrodethrough the first protective layer via-hole.
 3. The device according toclaim 1, wherein the color filter substrate further comprises: a colorfilter layer provided between the first substrate and the firstelectrode; the color filter layer comprises a black matrix and colorfilters separated by the black matrix; the second electrode is providedto correspond to the color filter, and the first connection electrode isprovided to correspond to the black matrix; in a region corresponding tothe first connection electrode, the first protective layer protrudesalong a direction away from the second electrode to from a protrusion;the first protective layer is provided with a window at a position wherethe second electrode is provided, and a portion of or the entire of thesecond electrode is exposed out of the window; the first connectionelectrode is provided on the protrusion, and the first connectionelectrode extends to the window to partially or completely covering anexposed portion of the second electrode.
 4. The device according toclaim 2, wherein the protrusion has a height of 1.5-2.5 micron.
 5. Thedevice according to claim 2, wherein the first connection electrode hasa thickness of 0.3-1 micron.
 6. The device according to claim 1, whereinthe first protective layer is made of silicon nitride, silicon oxide,photosensitive resin, or combinations thereof.
 7. The device accordingto claim 6, wherein the photosensitive resin is a polyacrylic resin, apolyimide resin, or a polyamide resin.
 8. The device according to claim1, further comprising: an array substrate, wherein the array substratecomprises: a second substrate, a thin film transistor provided on thesecond substrate, a protective layer covering the thin film transistor,and a second connection electrode provided on the protective layer; andthe protective layer is provided with a protective layer via-hole, andthe second connection electrode is connected to a drain electrode of thethin film transistor through the protective layer via-hole.
 9. Thedevice according to claim 8, wherein the second connection electrode isin contact with and is electrically connected with the first connectionelectrode.
 10. The device according to claim 8, wherein at a positionwhere the second connection electrode is provided, the protective layerprotrudes along a direction away from the thin film transistor to form aprotrusion.
 11. A fabrication method of an electroluminescence displaydevice, comprising: a fabrication process of a color filter substrate,wherein the fabrication process of the color filter substrate comprises:forming a first electrode, an organic electroluminescence layer and asecond electrode on a first substrate; forming a first protective layeron the first substrate on which the first electrode, the organicelectroluminescence layer and the second electrode have been formed, thefirst protective layer covering the second electrode and the organicelectroluminescence layer below the second electrode; and forming afirst connection electrode on the first substrate on which the firstelectrode, the organic electroluminescence layer, the second electrodeand the first protective layer have been formed, the first connectionelectrode being connected with the second electrode.
 12. The fabricationmethod according to claim 11, wherein the forming the first protectivelayer comprises: forming the first protective layer; and forming aprotrusion at a position of the first protective layer where the firstconnection electrode is to be formed and meanwhile forming a firstprotective layer via-hole at the protrusion by a patterning process. 13.The fabrication method according to claim 11, wherein before the formingthe first electrode, the organic electroluminescence layer and thesecond electrode on the first substrate, the method further comprises:forming a color filter layer, the color filter layer comprises a blackmatrix and color filters separated by the black matrix; the forming thefirst protective layer comprises: forming the first protective layer;and forming a protrusion at a position of the first protective layerwhere the first connection electrode is to be formed by a patterningprocess, and meanwhile forming a window at a position where the secondelectrode is located so that a portion of or the entire of the secondelectrode is exposed out of the window, the second electrode beingprovided to correspond to the color filter, and the first connectionelectrode being provided to correspond to the back matrix; the formingthe first connection electrode comprises: forming an electrode layer,and forming the first connection electrode on the protrusion and on anexposed portion of the second electrode by a patterning process, thefirst connection electrode partially or completely covering the exposedportion of the second electrode.
 14. The fabrication method according toclaim 11, further comprising a fabrication process of an arraysubstrate, the fabrication process of the array substrate comprises:forming a thin film transistor on a second substrate; forming aprotective layer on the thin film transistor, and forming a protectivelayer via-hole above a drain electrode of the thin film transistor by apatterning process; forming a second connection electrode on theprotective layer, the second connection electrode being connected withthe drain electrode of the thin film transistor through the protectivelayer via-hole.
 15. The fabrication method according to claim 14,wherein the fabrication process of the array substrate furthercomprises: at a position where the second connection electrode isprovided, the protective layer protrudes along a direction away from thethin film transistor to form a protrusion.
 16. The device according toclaim 3, wherein the protrusion has a height of 1.5-2.5 micron.
 17. Thedevice according to claim 3, wherein the first connection electrode hasa thickness of 0.3-1 micron.
 18. The device according to claim 2,wherein the first protective layer is made of silicon nitride, siliconoxide, photosensitive resin, or combinations thereof.
 19. The deviceaccording to claim 3, wherein the first protective layer is made ofsilicon nitride, silicon oxide, photosensitive resin, or combinationsthereof.